Tungsten Molybdenum Current Events | The Chip Challenges 1nm, And Can Not Do Without The Application Of Tungsten Materials!

With its excellent mechanical, thermal, electrical and other properties, tungsten materials have become indispensable raw materials for many modern industries. For example, tungsten copper alloys are required for the throat lining of large rockets, while tungsten molybdenum products are also required for many parts of small chips, such as diffusion barrier layers, bonding layers, electronic packaging materials, transistors, etc.

Chips are semiconductor components produced by integrated circuits after many complex design processes. They are composed of a large number of transistors and are widely used in TV, computers, stereos, electronic organs, DVD players, video recorders, mobile phones, remote controls, cameras, alarms and other equipment.

At present, the mainstream semiconductor manufacturing process has progressed to 5nm and 3nm nodes. As the number of transistors per unit area of the chip is close to the physical limit of semiconductor silicon materials, the chip efficiency can no longer be significantly improved year by year.

In order to solve this problem, TSMC research team doped bismuth (Bi) into two-dimensional materials, which not only challenges the product size below 1 nanometer, but also effectively solves the problem of high resistance and low current of two-dimensional materials.

Normally, the more transistors there are, the larger the data stored in the integrated circuit and the stronger the processing capacity. Therefore, it is necessary for semiconductor materials to challenge below 1nm in order to obtain chips with higher performance.

In addition to the method proposed by TSMC, which can effectively solve the shortcomings of commercial chips, scientists at Pennsylvania State University in the United States also proposed that transistors can be made of single-layer molybdenum disulfide and tungsten disulfide semiconductor materials, which can make the data processing of the semiconductor components manufactured faster.

Tungsten targets have become the preferred materials for diffusion barrier layers and bonding layers in chips due to their high melting point, high temperature resistance, large electron emission coefficient, good chemical stability and excellent heat dissipation performance. In addition, the mainstream packaging materials for integrated circuits are mostly tungsten materials - tungsten copper alloys.

In addition to excellent electrochemical performance and heat dissipation, W-Cu alloy also has the characteristics of thermal expansion coefficient matching with silicon chip and gallium arsenide, so it can make the electronic packaging materials have better performance in all aspects.

Baoji Longjirui Technology Co., Ltd. can provide conventional and customized tungsten and molybdenum products. We provide tungsten molybdenum products with good quality, high purity, smooth surface and reasonable price.

The data shows that from January to March 2021, the output of integrated circuits in China is about 82 billion pieces, with a year-on-year growth of 62.1%, while the import of integrated circuits is 155.27 billion pieces, with a year-on-year growth of 33.1%. It is worth noting that in March, the production capacity of domestic integrated circuits reached 29.09 billion, up 37.4% year on year. It can be seen that the demand for integrated circuits in the domestic market is strong, and the production growth rate is large. According to the budget, China may achieve a self-sufficiency rate of 70% in chips by 2025.