PVD Coating Material To Blast Air Outlet! The Market For New Material Stealth Champions Is Huge
Target material is a sputtering source that forms various functional films on the substrate by magnetron sputtering, electron beam evaporation or other types of coating system (equipment) under appropriate technological conditions.

General target material is mainly composed of target billet, backplane and other parts, among which, target billet is the target material bombarded by high-speed ion beam, which belongs to the core part of the sputtering target material. In the process of sputtering coating, after the target billet is hit by ions, the surface atoms are sputtered out and deposited on the substrate to make electronic film. pvd coating material #
The target material industry chain mainly includes metal purification, target material manufacturing, sputtering coating and terminal application, etc. Target material manufacturing and sputtering coating are the key links in the whole sputtering target material industry chain.
Among them, the quality of sputtering coating has an important influence on the quality of downstream products. In the process of sputtering coating, the sputtering target needs to be installed in the machine to complete the sputtering reaction.
At present, the preparation technology of thin film materials mainly includes physical vapor deposition (PVD) and chemical vapor deposition (CVD).
PVD technology is the mainstream coating method, specifically refers to the use of physical methods under vacuum conditions, the surface of a substance into gaseous atoms, molecules or partial ionization into ions, and through the low pressure gas process, deposition on the surface of the substrate material has a special function of the film material, according to the operation technology can be divided into sputtering coating and vacuum evaporation coating two methods.
PVD coating materials are used to prepare various thin films with specific functions. The main downstream applications include flat panel displays, semiconductor functional devices, solar cells, optical components and so on.
Sputtering machine has strong specificity and high precision. The market has been monopolized by American and Japanese multinational groups for a long time. The main equipment providers include well-known enterprises in the industry such as AMAT (USA), ULVAC (Japan), ANELVA (Japan) and Varian (USA).
Domestic high-purity sputtering target manufacturing enterprises have gradually broken through the key technical threshold, with the large-scale production capacity of some products, and formed a professional manufacturer of high-purity sputtering target represented by Jiangfeng Electronics, A Shi Chuang, Youyan Yijin, Longhua Energy Saving, etc.
The main products of Jiangfeng Electronics are various high purity sputtering targets, including aluminum target, titanium target, tantalum target, tungsten and titanium target, which are mainly used for the preparation of electronic thin film materials. At present, our products are mainly used in semiconductors, solar cells and flat panel displays.
A Shi Chuang is engaged in the research and development, production and sales of various PVD coating materials, leading products for sputtering target and evaporation materials two series.
The main products of Youyan Yijin include high purity metal targets, evaporation materials, orthodontic devices, medical intervention scaffolds, precious metal alloys and compounds, etc. The target products mainly include aluminum and its alloy targets, titanium targets, copper targets, tantalum targets, etc.
Sifeng Electronics acquired by Longhua Energy Saving is mainly engaged in the business of high purity metal and alloy materials, with molybdenum target materials as the main products. Jinglian Optoelectronics acquired by the company is mainly engaged in the research and development, production and marketing of indium tin oxide (ITO) target materials
These enterprises have strong R&D strength, sound management system and broad prospects for improvement. They are expected to break the monopoly situation of sputtering target material core technology by foreign countries and expand the market share of domestic sputtering target material.





