Intel Predicts The Era Of Trillion Transistor Chips: FinFET Will Be Eliminated

Over the past 50 years, the semiconductor industry has been deeply influenced by Moore's Law. This golden law has led to the advancement of chip technology. However, in recent years, Moore's Law has also been considered outdated. Die, the chip density will increase to 1 trillion transistors in 2030, which is 10 times the current level.

At the Hotchips 2022 conference last week, Intel CEO Henry Kissinger gave a keynote speech. He mentioned that advanced packaging technology will promote the development of Moore's Law and will develop System on Package, or SOP for short, and chip manufacturers will no longer provide a single wafer production, but a complete system-level service, including wafer production, advanced packaging, and integrated software technology.

According to Kissinger, the current chip has about 100 billion transistors at most. After the development of SOP technology in the future, the density of the chip will increase to 1 trillion transistors by 2030, which is 10 times the current level.

However, in order to achieve a 10-fold increase in transistor density, technological breakthroughs are still required. The FinFET transistor technology currently in use has reached its limit. Intel will abandon FinFET technology in the 20A process for mass production in 2024 and turn to RibbonFET and PowerVIA. generation technology.

RibbonFET, Intel's implementation of the Gate All Around transistor, will be the company's first new transistor architecture since it pioneered FinFET in 2011, according to Intel. This technology speeds up transistor switching while achieving the same drive current as a multi-fin structure, but in a smaller footprint.

PowerVia is Intel's unique and industry-first backside power delivery network that optimizes signal transfer by eliminating the need for front-side power routing on the wafer.