Molybdenum Box Heaters
Molybdenum box heaters applications:
• Rare earth extraction
• New material manufacturing
• Coating
• Electronics
• Moulds
Product Introduction
1. Product name: Molybdenum box heaters
Molybdenum box heaters are processed by bending, riveting, and welding, which can withstand a high temperature of 2100℃ and are used in rare earth extraction, new material manufacturing, coating, electronics, molds, etc. Molybdenum box heaters have stable physical properties in a high-temperature environment, minimal thermal expansion, do not pollute the heating chamber and product by volatilization, and the melting point exceeds 3600℃. We can process and produce various types of molybdenum box heaters according to the drawings, ordinary riveted molybdenum box heaters, sealed welded molybdenum box heaters, stamping, and spinning molybdenum box heaters, etc.
2. Main standard sizes:
Type | T(mm) | w(mm) | Lth (mm) | L1 | Deep(mm) |
310 | 0.3 | 10 | 100 | 60 | 1.5-2.0 |
215 | 0.2 | 15 | 100 | 60 | 1.5-2.0 |
315 | 0.3 | 15 | 100 | 60 | 1.5-2.0 |
515 | 0.5 | 15 | 100 | 60 | 1.5-2.0 |
218 | 0.2 | 8 | 100 | 60 | 1.5-2.0 |
312 | 0.3 | 12 | 100 | 60 | 1.5-2.0 |
251 | 0.2 | 10 | 50 | 25 | 1.5-2.0 |
353 | 0.3 | 13 | 50 | 25 | 1.5-2.0 |
220 | 0.2 | 15 | 102 | 40 | 5.0 |
223 | 0.2 | 23 | 100 | 15 | 1.5-2.0 |
dimensions and tolerance (according to requirements).
3. Molybdenum boat box production process:
molybdenum slab - blanking - semi-finished product multi-pass rolling - finished product rolling - shearing - wire cutting - bending - riveting - cleaning - inspection
4. Our company and factory:
Baoji Magotan Nonferrous Metals Co., Ltd is a manufacturer of process tungsten and molybdenum materials, located in the East High-tech Zone, Baoji City, Shaanxi Province. We have a wealth of tungsten and molybdenum production and processing techniques. The molybdenum box heaters by Magotan produced have high density, smooth surfaces, and no cracks or peeling.
5. Expand knowledge: The thin film preparation process can be divided into two categories according to its film-forming method: physical vapor deposition (PVD) and chemical vapor deposition (CVD), of which CVD process equipment accounts for a higher proportion. Physical vapor deposition (PVD) refers to vaporizing the surface of the material source and depositing it on the surface of the substrate by low-pressure gas/plasma, including evaporation, sputtering, ion beam, etc.; Chemical vapor deposition (CVD) refers to the process of depositing a solid film on the surface of a silicon wafer through a chemical reaction of gas mixing. It is divided into atmospheric pressure CVD (APCVD) and low-pressure CVD ( LPCVD), plasma-enhanced CVD (PECVD), high-density plasma CVD (HDPCVD), and atomic layer deposition (ALD).
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