Main Classification And Characteristics Of Semiconductor Equipment Parts
CIC integrated circuit [1] semiconductor industry is the core supporting industry to build China's strategic scientific and technological strength for self-reliance, and semiconductor components are the key areas to determine the high-quality development of China's semiconductor industry. Although China's semiconductor industry is at the stage of accelerated development, the domestic semiconductor parts industry
The semiconductor industry is the core supporting industry for building China's strategic scientific and technological strength, and the semiconductor components are the key areas that determine the high-quality development of China's semiconductor industry. Although China's semiconductor industry is currently in the stage of accelerated development, the domestic semiconductor parts industry is still facing many problems, such as low localization rate, insufficient long-term industrial support and investment, weak independent innovation ability of enterprises, sluggish industrial upstream and downstream linkage cooperation, and lack of talent training and incentive mechanism.
This paper will comprehensively sort out the development characteristics and key enterprises of the global semiconductor parts industry, study the market scale and development pattern at home and abroad, and put forward relevant development suggestions for the current major problems faced by the domestic semiconductor parts industry.
>>>Introduction
Semiconductor parts refer to the parts that meet the semiconductor equipment and technical requirements in terms of materials, structure, process, quality and accuracy, reliability and stability, such as O-Ring seal ring, EFEM (transmission module), RF Gen RF power supply, ESC electrostatic sucker, Si silicon ring and other structural parts, Pump vacuum pump, MFC gas flowmeter, precision bearing, ShowerHead gas sprinkler head, etc. Semiconductor equipment is composed of thousands of parts. The performance, quality and accuracy of the parts directly determine the reliability and stability of the equipment. It is also a key basic element for China's semiconductor manufacturing capacity to leap to the high-end. The domestic semiconductor parts industry started late, the overall level of China's semiconductor parts industry is low, the supply capacity of high-end products is insufficient, and the problems of poor product reliability, stability and consistency are increasingly prominent.
In the context of the increasingly complex global macro political economy and the continuous suppression and containment of the strategic rise of China's high-tech industry by the United States, the phenomenon of the industry being "choked" is more prominent, which not only seriously restricts the development of China's semiconductor industry to the advanced and high-end, but also brings risks that cannot be underestimated to China's digital economy, people's livelihood economy and national defense security.
>>>>Main classification and characteristics of semiconductor components
(1) Main classification of semiconductor parts
Semiconductor parts are the key components of semiconductor equipment. According to incomplete statistics, there is no standard for the classification of semiconductor parts in the industry. At present, there are mainly the following classification methods.
According to the internal process of typical integrated circuit equipment cavity, parts can be divided into five categories: power supply and RF control, gas transmission, vacuum control, temperature control and transmission device. Power supply and RF control include RF generator and matcher, DC/AC power supply, etc. Gas transportation mainly includes flow controller, pneumatic parts, gas filter, etc. Vacuum control includes various vacuum pumps such as dry pumps/cold pumps/molecular pumps, control valves/pendulum valves and other valves, pressure gauges and O-Ring seals. The temperature control category includes heating disk/electrostatic sucker, heat exchanger and lifting components. Conveyors include mechanical arms, EFEM, bearings, precision rails, stepping motors, etc.
According to the main materials and functions of semiconductor parts, they can be divided into 12 categories, including silicon/silicon carbide parts, quartz parts, ceramic parts, metal parts, graphite parts, plastic parts, vacuum parts, seals, filter parts, moving parts, electric control parts and other parts. The major categories of components also include several subdivided products. For example, vacuum components include vacuum gauges (measuring process vacuum), vacuum pressure gauges, gas flow meters (MFC), vacuum valves, vacuum pumps and other key components.
According to the service objects of semiconductor parts, semiconductor core parts can be divided into two types, namely precision machining parts and general outsourcing parts. Precision machining parts are usually designed by the engineers of each semiconductor equipment company, and then outsourced for processing. They will only be used on the equipment of their own company, such as process chambers, transmission chambers, etc. It is relatively easy to localize, and generally have high requirements for surface treatment, precision machining and other processes and technologies; General purchased parts are general parts that have been verified for a long time and widely recognized by many equipment manufacturers and manufacturers. They are more standardized, and will be used by different equipment companies, and will also be used as spare parts and consumables for production lines, such as silicon structural parts, O-Ring seals, valves, gauges, pumps, face plates, gas shower heads, etc. Because these parts have strong universality and consistency, And it needs to be certified by equipment and manufacturing line, so localization is difficult.
(2) Main characteristics of semiconductor parts industry
The semiconductor parts industry usually has the characteristics of high technology concentration, interdisciplinary integration, small and decentralized market scale, but plays an important role in the value chain. Generally speaking, equipment parts account for about 70% of the total equipment expenditure. Take etching machine as an example, ten major key parts account for 85% of the total equipment cost. It is the key support for the survival and development of the semiconductor industry, and its level directly determines the basic level of innovation in China's semiconductor industry.
a. It is technology intensive and requires high precision and reliability.
Compared with the basic components in other industries, semiconductor components are used for precision semiconductor manufacturing, and their cutting-edge technology intensive characteristics are particularly obvious. They are characterized by high precision, small batch size, multiple varieties, special size, complex process, and extremely demanding requirements. Due to the particularity of semiconductor parts, enterprises often need to take into account the strength, strain, corrosion resistance, electronic characteristics, electromagnetic characteristics, material purity and other composite functional requirements.
If the same component is feasible in traditional industry, but it is used in the semiconductor industry, it has higher requirements on the purity of raw materials, consistency of raw material batches, quality stability, machining accuracy control, edge chamfering and deburring, surface roughness control, special surface treatment, clean cleaning, vacuum dust-free packaging, delivery cycle and other aspects of key components, creating a high technical threshold.
For example, as the line width of semiconductor processing becomes smaller and smaller, the photolithography process is extremely strict in controlling minimal pollutants, not only the particles but also the metal ion precipitation of filter products, which puts forward high requirements for the production and manufacturing of filter pieces for semiconductors. At present, the precision of semiconductor filter element is required to be 1 nm or less, while in other industries, the precision is required to be in the micron level.
At the same time, filter elements for semiconductors also need to ensure consistency, chemical resistance and heat resistance, and extremely strong resistance to peeling, so as to achieve the high requirements of repeatable high performance, consistent quality and ultrapure product cleanliness required in semiconductor manufacturing.
b. Interdisciplinary integration requires highly compound technical talents.
There are many kinds of semiconductor parts, which cover a wide range and have a long industrial chain. Its R&D, design, manufacturing and application involve interdisciplinary and multidisciplinary integration of materials, machinery, physics, electronics, precision instruments, etc. Therefore, there is a great demand for compound talents.
Take the electrostatic sucker used to fix the wafer in semiconductor manufacturing as an example. It itself uses aluminum oxide ceramics or aluminum nitride ceramics as the main material, but at the same time, it also needs to add other conductive substances to make its overall resistivity meet the functional requirements. This requires a good understanding of the thermal conductivity, wear resistance and hardness indicators of ceramic materials to obtain basic raw materials that meet the technical indicators of semiconductor manufacturing; Secondly, the internal organic processing structure of ceramics requires high precision, and the combination of ceramic layer and metal base should meet the requirements of uniformity and high strength. Therefore, for the structural design and processing of electrostatic sucker, precision machining skills and knowledge are required; The electrostatic sucker shall be coated with a coating of about 0.01 μ m after surface treatment, and shall be resistant to high temperature and wear, with a service life of more than three years. Therefore, the requirements for mastering and applying the surface treatment technology are relatively high. It can be seen that compound and cross type technical talents are the basic guarantee of semiconductor parts industry.
c. Fragmentation is obvious. International leading enterprises mainly focus on cross industry and multi product line development and M&A strategies.
Compared with the semiconductor equipment market, the semiconductor parts market is more subdivided, with obvious fragmentation characteristics. The market space for a single product is very small, and the technical threshold is high, so there are few pure semiconductor parts companies.
International leading semiconductor parts enterprises usually focus on cross industry and multi product line development strategies, and semiconductor parts are often just one of the businesses of these large parts manufacturers. For example, MKS Instrument Co., Ltd. occupies a major market share in gas pressure gauge/reactor, RF/DC power supply, vacuum products, mechanical arms and other product lines. In addition to the application in the semiconductor industry, it is also widely used in industrial manufacturing, life and health sciences and other fields.
The continuous merger and integration is also the main means for the international leading semiconductor parts enterprises to expand their scale. For example, Atlas (Atlas Copco, Sweden), an international leading industrial equipment company, in order to continue to expand its semiconductor vacuum pump business, after acquiring Edwards in 2014, acquired another leader in the vacuum technology field, Leybold (Germany) in 2016, In 2017, a separate vacuum technology department was set up. In July 2019, Atlas acquired Brooks' cryogenic business again. This acquisition includes cryogenic pump operating company and Brooks' 50% stake in Ulvac Cryogenics Co., Ltd., further enhancing its global competitiveness in vacuum business in the semiconductor field.
>>>>Market scale and development pattern of semiconductor parts
(1) Scale and pattern of global semiconductor parts market
The global semiconductor parts market mainly consists of two parts according to different service objects. First, parts and related services customized or purchased by global semiconductor equipment manufacturers. According to the data provided by VLSI, the sales scale of semiconductor equipment subsystems in 2020 will be close to US $10 billion, of which maintenance+support services account for 46%, parts products account for 32% and replacement+upgrade accounts for 22%.
Second, parts and related services directly purchased by global semiconductor manufacturers as consumables or spare parts. According to Xinmou data, in 2020, the procurement amount of components for front track equipment of 8 inch and 12 inch wafer lines in mainland China exceeded US $1 billion. China's manufacturing capacity accounts for about 12-15% of the world's total. Considering the procurement demand for high-value added parts brought by advanced processes, the global procurement amount of 8 inch and 12 inch wafer line front-end equipment parts is at least 10 billion dollars. Therefore, by adding two parts of semiconductor parts sales market, it can be seen that the global semiconductor parts market is 20 billion to 25 billion dollars or even larger.
Although the overall size of the semiconductor parts market is less than 5% of the global semiconductor market size of nearly 500 billion dollars, the value of the parts is usually dozens of times of its own price, which has a strong industrial radiation capacity and influence. In addition, the key technologies of semiconductor components reflect the technical level of a country's industry and semiconductor equipment, and have a very important strategic position. Their technological progress is a prerequisite for technological innovation in the downstream digital economy and information application industries.
According to VLSI data, the top 10 leading suppliers of semiconductor parts in the world in 2020 (see Table 2-1) include ZEISS ZEISS (optical lens), MKS instruments (MFC, RF power supply, vacuum products), Edwards (vacuum pump), Advanced Energy (RF power supply), Horiba (MFC), VAT (vacuum valve), Ichor (modular gas delivery system and other components), Ultra Clean Tech (sealing system), ASML (optical components) and EBARA (dry pump).
(2) Scale and pattern of China's semiconductor parts market
At present, China's semiconductor parts industry is still in its infancy, and the overall scale is small. According to Xinmou data, in 2020, Chinese local wafer manufacturers (mainly including SMIC International, Huahong Group, China Resources Microelectronics, Changjiang Storage, etc.) will purchase 8 inch and 12 inch front channel equipment parts with an amount of about 430 million dollars. However, due to the rapid expansion of China's local wafer manufacturing capacity, it is expected that the demand for semiconductor parts will continue to be strong. According to the existing local wafer manufacturing capacity plan, there will be 50% new capacity by 2023. It is estimated that the market size of domestic semiconductor parts will exceed 8 billion yuan in 2023 and 12 billion yuan in 2025 according to the purchase demand of equipment and production lines with parts at the same time. Despite the rapid growth of the domestic semiconductor parts market, the technical capacity, process level, product accuracy and reliability of domestic parts enterprises are far from meeting the needs of domestic equipment and wafer manufacturers, and the overall localization rate is still at a low level. Generally speaking, the localization rate of precision machining parts produced by customized design is relatively high in China.
Because in the initial stage of domestic semiconductor equipment, in order to catch up with the advanced level in mass production as soon as possible, the mode of self design and processing by foreign (mainly Japan, a small number of South Korea) processors is often adopted. Due to the special requirements for raw materials, processing methods, surface treatment methods and cleaning and packaging of precision machined parts of semiconductor equipment, domestic processors cannot meet these requirements for the time being. In addition, because Japanese processing technology suppliers have rich experience in processing the same type of parts, some design errors can be found and adjusted during processing.
Later, with the gradual expansion of the domestic market, a small number of domestic semiconductor equipment manufacturers, in order to reduce costs and ensure the safety of the supply chain, began to gradually cultivate domestic processors in other industries to engage in precision parts processing of semiconductor equipment. Therefore, in the field of precision machining parts dominated by equipment manufacturers, domestic parts manufacturers have made rapid progress. However, for general outsourcing parts that are more standardized and highly dependent on market competition, the localization rate is generally low. The main reason is that the design and production requirements of these general outsourcing parts are very high. Even though the samples of domestic products can reach the same level, efforts are still needed to ensure the stability of mass production. At the same time, because domestic equipment enterprises have just made progress in localization, they are still relatively passive in the procurement of general-purpose parts, mainly focusing on mature domestic products, and are unwilling to venture to try new domestic products.
These are the main reasons why China is still unable to achieve "self control" in the core products of semiconductor components. According to the data of domestic mainstream manufacturers, at present, there are more than 2000 kinds of parts (maintenance replacement and invalid replacement parts) received in the daily operation of the whole year, but the domestic share is only about 8%. The United States and Japan accounted for 59.7% and 26.7% respectively.
In fact, the high-end parts market is mainly occupied by American, Japanese and European suppliers; The middle and low-end parts market is mainly occupied by Korean and Taiwan suppliers. Electrostatic sucker is a key non consumable component of wafer manufacturer, with unit price up to tens of thousands or even hundreds of thousands of dollars. At present, no domestic enterprise can produce relevant mature products. Even the aluminum nitride ceramic raw materials used in the electrostatic sucker can not meet the required technical indicators, and the dependence on the outside is more than 99%.
In addition, although the scale of vacuum pump industry in China is close to 200 billion yuan, it still needs to import high-end products from Edwards and other enterprises in terms of semiconductor dry vacuum pumps. However, in recent years, with the acceleration of new production capacity and expansion of the domestic semiconductor industry, the logistics and transportation services have been blocked due to the superposition of the new epidemic situation, which has led to the continuous delay in the delivery of foreign parts, bringing opportunities for some domestic semiconductor parts enterprises with high growth potential to accelerate domestic substitution. For example, Jiangfeng Electronics' ShowerHead and cavity processing business, Cobalt's filter business, Tongjia Hongrui's dry vacuum pump business, etc. Table 2-3 summarizes some Chinese enterprises in different semiconductor parts fields.
>>>>Main Problems Faced by Localization of Semiconductor Parts
(1) Lack of attention to parts and components and dislocation of industrial support policies
The total scale of the semiconductor parts industry is billions. Compared with the semiconductor core industry chain, it is small in size, has a wide variety of products, a small number of leading enterprises, a low degree of industrial concentration, and scattered technical problems. Therefore, it has not received enough attention for a long time.
Since 2014, China has promoted the development of the semiconductor industry to the national strategy. Subsequently, at least 30 local governments have issued support policies to promote the development of the semiconductor industry [9]. However, at both the national and local levels, policies focus more on design, manufacturing, packaging, testing, equipment and materials, and rarely cover the semiconductor parts industry.
In terms of capital, spare parts enterprises rarely get capital appreciation. At present, the National Investment Fund for Integrated Circuit Industry has a small proportion of investment in the field of semiconductor parts, with an investment amount of less than 100 million yuan. By the end of 2020, the total market value (less than 30 billion yuan) of listed companies focusing on semiconductor parts only accounts for 1% (more than 3 trillion yuan) of the total market value of all semiconductor industry chain enterprises.
(2) The innovation ability is relatively backward, and the gap between core technologies is obvious
Since the parts industry has not received much attention for a long time, it can only grow in an extensive way. Therefore, most domestic parts enterprises enter the semiconductor industry mainly to provide maintenance and replacement services and cleaning services. The overall R&D investment is not enough, the innovation ability is relatively backward, and they have stayed at the level of low-end production standards and copying foreign products for a long time. The core technology gap is obvious.
According to the prospectus of a listed semiconductor parts company in China, the total number of its R&D personnel is only 15. From 2016 to 2018, the total R&D investment was less than 20 million yuan, and the annual R&D investment intensity was less than 5%. In addition, the lack of innovation ability of China's semiconductor parts industry is also reflected in many problems, such as imperfect industry standard system, serious insufficient investment in basic process research, poor access to process technology, and the lack of close integration of scientific research and production practice, which restrict the innovative development of structural design technology, reliability technology, manufacturing process and flow, and basic material performance research of semiconductor parts products.
(3) Inadequate supply of craftsmen and lack of effective incentive mechanism
At present, China's semiconductor industry has a talent shortage of hundreds of thousands of people. Although China has introduced a series of support measures for semiconductor talent training in recent years, a large number of semiconductor talent training mainly focuses on the design, manufacturing, equipment and materials links. There is still a lack of attention to the talent training of basic industries such as semiconductor parts. In the reform of the education system of basic disciplines, professional settings, in-service engineering education In terms of technical qualification certification, there is a lack of overall planning and implementation, and the curriculum arrangement for the professional basis and professional skills of parts and components is seriously insufficient. At the same time, there is a lack of guidance for the craftsman spirit that advocates refinement, realism, innovation, and is good at design and hard work [5].
In addition, the semiconductor parts industry is facing a serious problem that the talent incentive mechanism is not in place. Although the overall salary level of the domestic semiconductor industry personnel has been significantly improved compared with the previous ones, the salary of the employees in the mechanical processing, precision instruments, surface treatment and other industries required by the parts enterprises is generally significantly lower than the average level of the semiconductor industry. According to the prospectus of a domestic semiconductor parts enterprise, there were only 15 R&D personnel before its listing, with the annual salary of core technicians being only 75000 and that of ordinary R&D personnel being only 30000. The low salary level has led to a serious brain drain in semiconductor parts enterprises, resulting in a lack of successors in the basic parts industry and a vicious circle.
(4) All links of the industrial chain are disconnected, and the upstream support capacity is insufficient
Semiconductor parts need to go through strict and complex verification procedures before they pass the verification of large-scale production lines and achieve large-scale sales. Therefore, the parts manufacturers need to have full cooperation with downstream equipment and manufacturers.
At present, the online verification procedure of domestic semiconductor parts is complex and long, the cooperation between manufacturers, equipment manufacturers and domestic semiconductor parts manufacturers is not high, and there is a lack of effective communication and interaction. As a result, both parties do not know each other's process parameters and matching, and domestic substitution power is insufficient. In addition, in the long process of product iteration, existing foreign component manufacturers have formed a large number of Know How (technical know-how).
However, in the process of subsequent imitation and trial production, domestic manufacturers usually can only achieve similarity in shape. Due to lack of experience and key technologies, they are eliminated in the initial verification and cannot enter large-scale application [5]. In addition, domestic semiconductor component manufacturers cannot obtain support from supporting links such as raw materials and production equipment, which also affects the competitiveness of their products.
Semiconductor components are generally products with multiple varieties and high requirements for processing accuracy, which require high raw materials and processing equipment and are expensive. Due to the influence of the long formed idea of "focusing on the main machine and neglecting the supporting parts" on China's industry, the investment in the upstream and downstream supporting parts field is seriously insufficient, which leads to the gap between China and foreign countries in the raw materials and production equipment of parts. For example, at present, the high-precision machining centers commonly used for semiconductor metal parts lag behind foreign countries in terms of machining accuracy, machining stability, geometric flexibility, etc.
For another example, the raw materials for high-end metal parts manufacturing, such as aluminum alloy metal, tungsten molybdenum metal, and the upstream raw materials of quartz pieces, such as high-purity quartz sand, are basically monopolized by American and Japanese companies. The supply of monopoly raw materials limits downstream material suppliers/processors/users to passivity. The mainstream quartz glass materials (tube/rod/anchorage) are also basically from American, German and Japanese companies.
The shortage of upstream processing equipment and raw materials has led most semiconductor parts enterprises in China to operate at a low technological level for a long time. The level of raw materials and process equipment is not high, and advanced equipment is lacking and not matched, which cannot ensure the consistency of product quality and affects the improvement of product quality.
(5) Some manufacturing conditions are limited, affecting high-end upgrading
Since the semiconductor manufacturing process is often in a high-temperature and highly corrosive environment, more than half of the semiconductor components need to be surface treated to improve their corrosion resistance. For example, the plasma etching chamber of semiconductor etching equipment is in a high-density, highly corrosive and highly active plasma environment, and the chamber and its components are extremely vulnerable to plasma corrosion. In order to extend the service life of these components, anodizing is often used on the surface of aluminum based materials (aluminum and aluminum alloy), which can effectively reduce the corrosion of plasma on the chamber and other aluminum based materials.
However, China's increasingly strict environmental protection requirements have led to the controlled development of most surface treatment technologies, such as sand blasting, melt spraying, electroplating and anodic oxidation, which has led to a large gap in some high-end surface treatment processes, such as micro arc oxidation, high-end spraying, Y2O3 ceramic coating, etc., which also directly affects the performance and quality of parts and components, such as valve, gas shower head, ceramic, etc, Although Chinese manufacturers can shape according to the drawings, their development is constrained by the foundation because they cannot solve the problems of materials and surface treatment. In addition, some cutting-edge technologies of semiconductor parts are limited by the "embargo", and domestic enterprises lack drawings and precision data, so they can not evolve to high-end technologies. For example, low pressure vacuum gauges produced by MKS have always been available only after applying for export licenses.
>>>>Suggestions on the Development of China's Semiconductor Parts Industry
(1) Attach importance to top-level design and guide industrial development
The field of semiconductor parts is a key "choke" link that has been heavily dependent on advanced countries such as the United States and Japan for a long time, so more attention should be paid to top-level design. It is suggested to determine the long-term strategic framework for industrial development by formulating special plans, plans or roadmaps for the development of the semiconductor parts industry, and formulate appropriate policies and plans in different periods according to the development situation at home and abroad so as to guide the industrial development in an orderly manner, which also causes the whole society, especially the market-oriented capital, to attach importance to the semiconductor parts industry.
(2) Set up special industry projects to stimulate innovation vitality
In order to realize the rapid development and prosperity of the semiconductor parts industry, the most fundamental thing is to strengthen the ability of independent innovation. At present, China's semiconductor parts industry can no longer achieve comprehensive protection of the semiconductor supply chain only by imitating and tracking the technology. Only through independent innovation can we achieve transcendence. Although some parts enterprises have been supported in the 02 special project [7], further efforts should be made. It is suggested that a special project for semiconductor parts industry should be set up separately in the national science and technology plan, the leading enterprises of semiconductor parts in China should be united, the national level parts technology innovation platform or research institute should be prepared, the superior forces should be gathered to aim at the breakthrough and the main direction, the independent innovation research and development should be adhered to, the key core technologies of a batch of industrial infrastructure should be focused on, and a technology innovation system with enterprises as the main body and the combination of production, teaching, research and application should be established, Guide the research and development of cutting-edge technologies, basic technologies and key generic technologies in the field of semiconductor components at the national level.
(3) Make up policy gaps and strengthen investment guidance
The semiconductor parts industry is an industry with sufficient market competition. The domestic parts enterprises are small in scale, large in number, and thin in product profits. The R&D investment in new products and technologies cannot be compared with that of international large enterprises. It is difficult to win simply by market competition. However, under the current international geopolitical background, the government needs to implement relevant special policies to guide and support the rapid growth of domestic semiconductor parts enterprises. It is suggested that the national finance and local finance should give post subsidy and support to major products independently developed by domestic semiconductor parts enterprises, strengthen the protection of intellectual property rights of independently designed products, and include semiconductor parts products in the government's first procurement catalog. Encourage all kinds of domestic industrial funds and social capital, actively invest in semiconductor parts enterprises, and help the development of domestic semiconductor parts enterprises through the capital market.
(4) Increase talent introduction and training and strengthen talent supply
Comprehensively strengthen the training and introduction of engineering, scientific research and composite talents in semiconductor parts related fields [8]. Large scientific research institutions are encouraged to establish postgraduate education and post doctoral workstations in the direction of semiconductor parts, and cultivate leading talents in semiconductor parts engineering relying on national major engineering projects and major scientific and technological projects.
Advocate enterprises, schools and scientific research institutions to jointly carry out vocational education and on-the-job training, actively promote the mode of school enterprise cooperation to jointly cultivate skilled personnel, and cultivate a large number of skilled personnel for semiconductor components through order education, centralized training, targeted training or entrusted training between schools and enterprises, so as to strengthen talent supply. Actively introduce overseas engineering technology leaders and scarce talents in various ways, encourage local governments to introduce talent policies for core technology backbones and leading entrepreneurs in the semiconductor parts field, constantly improve the talent incentive mechanism, and stimulate the vitality of industrial development.
(5) Promote linkage of machinery and components to ensure independent supply
Promote the "machine linkage" of semiconductor basic supply chain, completely reverse the disconnection between parts and equipment and manufacturing industry, encourage domestic wafer factories and equipment factories to effectively play the role of organization and coordination of large production lines through government guidance, and cooperate with local parts manufacturers to strengthen the cooperation of the industrial chain through a variety of ways, such as unveiling the list, racing horses, and targeted tackling key problems, so as to achieve the coordinated development of host and basic parts.
Support semiconductor manufacturing or equipment engineering projects led and invested by the national or local government, give priority to domestic semiconductor parts product verification opportunities, and give certain risk subsidies. Encourage equipment parts manufacturers in machinery, electronics, chemical industry and other fields to actively expand and expand semiconductor business, develop more high-end products based on their own technical foundation to meet the needs of semiconductor equipment, further consolidate and improve the product layout, and improve the independent supply capacity of domestic parts.
