Tungsten Molybdenum Current Affairs | Not Simple! Molybdenum Sputtering Target For Semiconductor!
Nowadays, sputtering targets are widely used, ranging from the semiconductor industry to film deposition of various materials in the processing of integrated circuits, to energy-saving glass windows in buildings, familiar hard gold coatings made of titanium nitride, and wear-resistant coatings for tools and consumer goods. All materials can be obtained in the form of sputtering targets for metal deposition during CD and DVD production.
Sputtering is a mature technology, which can deposit films of various materials onto substrates of various shapes and sizes. This process is repeatable and can be extended from small projects to production involving medium to large substrate areas. Sputtering gas is usually inert gas, such as argon. In order to transfer momentum effectively, the mass of the incident particle must match the mass of the target.
In order to obtain the required properties in the sputter deposited films, the manufacturing materials and processes used to manufacture the sputter targets are critical. In addition to pure metal targets such as tungsten, molybdenum, niobium, titanium, and silicon, there are alloy targets such as tungsten, molybdenum, titanium, silicon, tantalum, and compounds such as oxides or nitrides. The process of determining materials is as important as the deposition operation parameters perfected by engineers and scientists during the coating process.
Compared with other deposition methods, sputtered films have better adhesion on the substrate, and materials with high melting points such as molybdenum and tungsten are also easy to sputter. Sputtering can be carried out from top to bottom, while evaporation can only be carried out from bottom to top.
Sputtering targets are usually round or rectangular, and other shapes can be made, including square and triangular designs. The substrate is an object to be coated, which may include a semiconductor chip, a solar cell, an optical module, or many other possibilities. The thickness of the coating is usually in the range of angstrom to micrometer. The film can be a single material or a variety of materials with multilayer structure.
As a very versatile refractory metal, molybdenum has excellent mechanical properties, low expansion, high thermal conductivity and extremely high conductivity at high temperatures. It can be used as sputtering target in many combinations, such as pure molybdenum target, molybdenum titanium target, molybdenum tantalum target and molybdenum alloy target (such as TZM plate). Molybdenum sputtering targets have the characteristics of high purity, high density, fine and uniform grains, so that high sputtering efficiency, uniform film thickness and smooth etching surface can be obtained in sputtering.
All target products of Baoji Longjirui Metal Technology Co., Ltd. are specially designed to operate reliably during film deposition. Our manufacturing process ensures high purity, fine and uniform particles of the target. We offer a variety of purity and shape options.
