High Density W-Ni-Cu Alloy

High density W-Ni-Cu alloy is an alloy composed of tungsten and copper. The copper content of commonly used alloys is 10% to 50%. The High density W-Ni-Cu alloy is prepared by powder metallurgy and has good electrical and thermal conductivity, good high-temperature strength, and certain plasticity. At very high temperatures, such as above 3000 °C, the copper in the alloy is liquefied and evaporated, absorbing a large amount of heat and reducing the surface temperature of the material.

Since the two metals of tungsten and copper are incompatible with each other, the high density W-Ni-Cu alloy has a low expansion, wear resistance, corrosion resistance of tungsten, and high electrical and thermal conductivity of copper, and is suitable for various machining. Tungsten-copper alloy can be produced and dimensioned according to user requirements.

High density W-Ni-Cu alloy is a two-phase structure pseudo-alloy mainly composed of tungsten and copper elements. It is a metal composite material. Due to the large difference in physical properties between metal copper and tungsten, High density W-Ni-Cu alloy cannot be produced by melting and casting methods, and powder alloy technology is generally used in production. 

High density W-Ni-Cu alloy generally use a powder metallurgy process: first powder - batching mixing - pressing and forming - sintering and infiltration

Tungsten copper electrode: welding electrode -tungsten copper alloy has high-temperature resistance, arc ablation resistance, high specific gravity, and high electrical conductivity and thermal conductivity, and is easy to machine and suitable for use in welding electrodes.

High density W-Ni-Cu alloy rod: Tungsten-copper is a composite material refined by the process of static pressing, high-temperature sintering, and copper infiltration by utilizing the excellent metal properties of high-purity tungsten powder and the plasticity and high conductivity of high-purity copper powder. Good arc breaking performance, good electrical and thermal conductivity, small thermal expansion, no softening at high temperature, high strength, high density, and high hardness.

Tungsten-copper electronic packaging sheet: Tungsten-copper electronic packaging material: It has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. Its thermal expansion coefficient and electrical and thermal conductivity can be changed by adjusting the composition of the material. Convenience is provided.

Tungsten copper tube: Tungsten copper alloy tube is widely used in cemented carbide and insoluble metals. Because the tungsten-copper alloy is easy to machine, the use of tungsten-copper tube has played a great role in the case where the surface needs to be easy to cut and the inner diameter is required to be small.

High density W-Ni-Cu alloy has a wide range of uses, a large part of which is used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment, and other industries. Secondly, High density W-Ni-Cu alloy is also used to manufacture contacts of high-voltage electrical switches that are resistant to arc ablation, rocket nozzle throat linings, rudders, and other high-temperature components. 

High density W-Ni-Cu alloy combines the advantages of copper and tungsten, high strength, high specific gravity, high-temperature resistance, arc ablation resistance, good electrical conductivity, and good processing performance. High-quality tungsten powder and oxygen-free copper powder are used, and isostatic pressing (high-temperature sintering-copper infiltration) is used to ensure product purity and accurate ratio, fine structure, and excellent performance. Good arc breaking performance, good electrical conductivity, good thermal conductivity, and small thermal expansion.

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